EMC實驗中 ，靜電保護的基本方法。
Introduction
Many ESD standards such as the Human Body Model (HBM), Machine Model (MM),
Charged Device Model (CDM), and IEC 61000-4-2 have been developed to test for
robustness and ensure ESD protection. These standards are often misunderstood and
sometimes used interchangeably, which can result in tested, “protected” systems that later
fail in the consumer’s hands. To ensure better product reliability, it is critical that today’s
design engineer understand the significant differences between the manufacturing
environment and system end user environment ESD testing. The purpose of traditional
ESD testing of integrated circuits in the manufacturing environment is very different than
system level testing. HBM, MM and CDM tests are intended to ensure that integrated
circuits survive the manufacturing process. Processes such as packaging, final testing,
shipment to a board assembly facility, placement on the circuit board, and the soldering
process should be performed in controlled ESD environments that limit the level of ESD
stress to which the device is exposed.
Integrated Circuits (ICs) are inherently susceptible to ESD damage. This damage can occur
during the process of assembling the ICs into boards and finished systems, packaging or in
the field. There are several current methods for rating ICs for ESD in the manufacturing
environment. The most common include:
HBM - this standard is intended to simulate a person becoming charged and
discharging from a bare finger to ground through the circuit under test.
MM - intended to simulate a charged manufacturing machine, discharging through
the device to ground.
CDM - simulates an integrated circuit becoming charged and discharging to a
grounded metal surface.
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